【Overview】
[] XIAO ESP32S3 Plus, powered by ESP32-S3's 240MHz Xtensa 32-bit LX7 dual-core processor, brings more SMD pins to the tiny versatile XIAO ESP32S3. While maintaining all the powerful features including WiFi and BLE 5.0 wireless connectivities, 2.4GHz Rod antenna, and ultra-low power consumption of 14μA in deep sleep mode with lithium battery charging management, the Plus variant features redesigned castellations and pad layout on the back, offering 9 additional GPIOs specifically for advanced Bluetooth projects requiring expanded I/Os via SMD board-to-board soldering. It's ideal for advanced IoT projects, Smart Homes, and professional wireless devices requiring extra I/O connectivity.

【Feature】
[] Seeed Studio XIAO ESP32S3 Plus, powered by ESP32-S3's 240MHz Xtensa 32-bit LX7 dual-core processor, brings more SMD pins to the tiny versatile XIAO ESP32S3. While maintaining all the powerful features including WiFi and BLE 5.0 wireless connectivities, 2.4GHz Rod antenna, and ultra-low power consumption of 14μA in deep sleep mode with lithium battery charging management, the Plus variant features redesigned castellations and pad layout on the back, offering 9 additional GPIOs specifically for advanced Bluetooth projects requiring expanded I/Os via SMD board-to-board soldering. It's ideal for advanced IoT projects, Smart Homes, and professional wireless devices requiring extra I/O connectivity. XIAO ESP32S3 Plus additionally features an upgraded 16MB Flash memory for advanced applications.

[] High-Performance MCU: Dual-core ESP32-S3 at 240MHz, Arduino / MicroPython / ESP-IDF compatible

[] Advanced Wireless: 2.4GHz WiFi + BLE 5.0, 100m+ range with U.FL antenna support

[] Efficient Power Management: Four power modes with 14μA deep sleep, integrated Li-ion charging

[] Expanded 20 GPIOs: 9 extra 1.27mm pitch SMD castellation pins beyond standard XIAO nRF52840

[] Universal Compatibility: Standard backside layout (with aligned battery pads, and debugger pads) for more to-be-released XIAO expansion boards

[] Classic XIAO Form Factor: 21 x 17.8mm design with 2.54mm pin headers, single-sided mounting for wearables and space-constrained projects

[] XIAO Accessory Add-ons Compatibility: Natively compatible with all the XIAO accessory add-ons of expansion, connectivity modules (LoRa, CAN_Bus, RS-485), sensors (2-Mic Array, Vision AI, mmWave Motion, Environmental sensing), and actuators (ePaper display, LED Matrix, relay and more).

【Specification】

Item	Seeed Studio XIAO ESP32S3	Seeed Studio XIAO ESP32S3 Plus
Processor	ESP32-S3R8 Xtensa LX7 dual-core, 32-bit processor that operates at up to 240 MHz
Wireless	Complete 2.4GHz Wi-Fi subsystem BLE: Bluetooth 5.0, Bluetooth mesh
Memory	On-chip 8M PSRAM & 8MB Flash	On-chip 8M PSRAM & 16MB Flash
Interface	1x UART, 1x IIC, 1x IIS, 1x SPI, 11x GPIOs (PWM), 9x ADC, 1x User LED, 1x Charge LED 1x Reset button, 1x Boot button	2x UART, 1x IIC, 1x IIS, 2x SPI, 18x GPIOs (PWM), 9x ADC, 1x User LED, 1x Charge LED, 1x B2B Connector, 1x Reset button, 1x Boot button
Dimensions	21 x 17.8mm
Power	Input voltage (Type-C): 5V Input voltage (BAT): 4.2V
	Circuit operating Voltage (ready to operate): - Type-C: 5V@19mA - BAT: 3.8V@22mA	Circuit operating Voltage (ready to operate): - Type-C: 5V@28mA - BAT: 3.8V@35mA
	Charging battery current: 100mA
Low Power Consumption Model	Modem-sleep Model: 3.8V/25 mA Light-sleep Model: 3.8V/2 mA Deep Sleep Model: 3.8V/14 μA	Modem-sleep Model: 3.8V/26.5 mA Light-sleep Model: 3.8V/2.2 mA Deep Sleep Model: 3.8V/69 μA
Wi-Fi Enabled Power Consumption	Active Model: ~ 100 mA	Active Model: ~ 85 mA
BLE Enabled Power Consumption	Active Model: ~ 85 mA	Active Model: ~ 77 mA
Working Temperature	-40°C ~ 65°C

【Hardware Overview】

【PinOut】

【Application】

[] Internet of Things

[] Wearable devices

[] Smart Homes

[] Robotics

[] Health monitoring

[] Education

[] ESP-Now Communication

[] Low-Power(LP) networking

【Size】

[] XIAO-ESP32S3-Plus

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